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To meet the dynamic challenges of our customers, NTK Thermal Division of NTK group utilizes a wide range of technologies to address the thermal management needs across all industries. Decades of experience in air and liquid cooling make NTK thermal Solution the world leader in designing, testing, and fabricating cooling solutions for the most demanding and cutting edge products. With such a high level of expertise, NTK is uniquely qualified to help you select the right technology for your application.
Each technology can be utilized as either passive or active cooling solutions depending upon product and customer requirements. Learn more about each of the technologies below, or contact NTK for assistance in selecting the right technology for your solution.


Heatpipe

The heat pipe consists of a shell, a liquid-absorbing core, and a working fluid. The working section of the heat pipe can be divided into three parts: evaporation section, insulation section, and condensation section. When the evaporation end is heated, the working substance immersed in the fine liquid core is evaporated through the tube wall. Under the pressure difference between the evaporation and condensation end, the steam flows to the condensation end. Because the condensation end is cooled, the steam condenses into liquid, releasing the vaporization potential. The condensate is conveyed back to the evaporation section by the capillary force produced by the combination of the wick and the liquid to form a working cycle.
Characteristics of Heat Pipes:
1. High heat transfer capacity of the heat pipe.
2. The uniform temperature characteristic of the heat pipe is good.
3. The capability of variable heat flux.
4. Good thermostatic properties

Vapor Chamber

Vapor Chamber vacuum chamber soaking plate technology is similar to heat pipe in principle but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber soaking plate is conducting on a two-dimensional surface, so the efficiency is higher. Specifically, the liquid at the bottom of the vacuum chamber absorbs the heat of the chip, evaporates and diffuses into the vacuum chamber, transfers the heat to the fin, and then condenses to the liquid back to the bottom. This kind of evaporation and condensation process similar to refrigerator air conditioning circulates rapidly in the vacuum chamber and achieves a fairly high heat dissipation efficiency.
Fin structure
Air cooling
Although liquid cooling becoming more popular, air cooling is still the most common type of electronics cooling. Often equated with fans, air cooling encompasses both forced and natural convection. An extremely simple example of air cooling would be the use of a heat sink or heat spreader used on its own, where the heat sink conducts heat away from the heat source to the ambient air. More complex air-cooled thermal solutions would include air movers such as fans, blowers, pulsejets, or even air to the air heat exchanger.
Active and passive heatsink
Liquid cooled heatsink

Liquid cooling

As electronics become more powerful they are generating much higher heat loads and require more efficient cooling. For many of these applications, traditional air cooling has become insufficient. Liquid cooled solutions are becoming more popular as they have the capacity for higher heat transfer and design flexibility. This allows for smaller, higher performing cooling solutions.
A liquid cooling system is a hydraulic circuit that typically consists of a cold plate that interfaces with the heat source, a pump that circulates the fluid through the system, and a heat exchanger that rejects the heat absorbed by the liquid from the device. Liquid cold plates have a much smaller working envelope than a heat sink that would be used in an air cooled solution for the same application. Additionally, multiple cold plates can be used with the same pump and heat exchanger, enabling remote cooling for several devices.
In addition to more efficient cooling, liquid systems also tend to have more design flexibility.
Liquid cold plates come in a wide range of shapes, sizes, and fabrications and the nature of liquid cooling allows for heat to be transferred and dissipated remotely. Liquid cooling also grants an additional level of control over the cooling system as the inlet temperature to the cold plate and flow rate can be easily modulated.
Liquid Cold plates are a critical component of a liquid cooled system. NTK's liquid cold plate technology is the broadest range designed and manufactured in the industry. Our global capabilities enable us to develop and produce more efficient and compact cooling for extremely high heat loads while still maintaining design flexibility and reducing costs.
The cold plate is the component of the liquid cooling system that interfaces with the heat source. Cold plates vary widely in complexity and construction depending on the application needs. A cold plate can be as simple as a copper tube attached to an aluminum plate or they can be extremely complex utilizing multiple technologies to achieve optimized heat transfer. These technologies can include high heat transfer fins, highly engineered micro or medium channels, or varied manufacturing processes such as vacuum, CAB, or dip brazing.